MONROVIA, CA - March 23, 2003 -- Xponent Photonics Inc. announces the first public demonstration of Surface Mount Photonics (SMP) this week at the Optical Fiber Communications Conference in Atlanta, Georgia. This new technology dramatically reduces the cost, footprint and complexity of single-mode fiber optic components.

"Surface Mount Photonics solves the core problems of optical component packaging by reducing complexity," said Jeff Rittichier, Xponent's President and CEO. "With Surface Mount Photonics, we've dramatically reduced the number of subcomponents, completely eliminated hermetic packages and simplified assembly to the point where it can be easily outsourced to contract manufacturers. Consequently, our customers, optical component and module vendors, benefit from reduced design, operations and materials costs without sacrificing device performance."

Xponent has solved three of the costliest problems in optical component packaging; 1) how to efficiently couple multiple die using high-speed, passive assembly, 2) the elimination of hermetic packages, and 3) the ability to perform test and burn-in at the wafer level. Surface Mount Photonics replaces nearly all of the optical subcomponents in a typical package with surface mount converters. These structures are added to standard devices, such as edge emitting lasers, at the wafer level thousands at a time. Surface mount converters function like "optical wire," enabling efficient optical power transfer between SMP chips when they are bonded together. These converters also make it possible to tap light out of active devices at the wafer level in order to identify failed parts before they are separated and needlessly assembled onto submounts. Additionally, because the optical train is fully enclosed within the assembled chipset, standard encapsulation materials and techniques can be used in place of hermetic packages.

Xponent will demonstrate its SMP capability for the first time at OFC. A compact (2x5mm)
1310nm SMP fiber-coupled laser will be operating underwater without a hermetic package. The demonstration is located in booth 1952.

Initial Xponent products include transmit optical sub-assemblies (TOSA) and fiber-ready PIN diode assemblies for 1310nm single-mode applications including SONET, Fiber Channel and Gigabit Ethernet.

Xponent designs and manufactures Surface Mount Photonics chipsets. Surface Mount Photonics dramatically reduces the cost and complexity of single-mode optics while providing industry-leading specifications for reach, thermal performance, power consumption and footprint. The company's investors include El Dorado Ventures, Morgenthaler Ventures, US Venture Partners, and Walden International.

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